Depends on the solder. Traditionally solder is an alloy of tin and lead (not anymore of course - no lead anymore) but most wire type solder is what they call "flux cored" ie the solder is extruded with flux embedded in the centre. A lot of flow soldering type processes rely on the two parts to be joined being "pre-tinned" ie coated with solder before jointing with a flow of liquid solder. I don't know exactly what they use for BGA techniques but it is probably a solder paste which may contain an amount of flux, but again it's probably done pre-tinned. It helps to keep process temperatures down.
If the console shuts down after the point at which the solder gets hot enough to melt, chances are it's doing some damage to the silicon substrate. Not loads granted because the chips need to be able to survive the solder process in the first place, but then the solder process will be much better controlled anyway. To be fair, if it gets a bit more life out of a poorly made device then fair play, but if you have to do this repeatedly you WILL shorten the chip lifespan.

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I've got a 360 with a RRoD problem....
DST and Darksiders since doing this fix, that's a lot of hours and the 360 hasn't seen the RRoD once. At the risk of jinxing myself, I'd say the flux (and possibly the xclamp replacement) has fixed it. I'll subscribe to this thread and post if it dies, otherwise assume it's job done.







